Decapping Pictures

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Revision as of 13:11, 10 December 2013 by Pdanner (Talk | contribs) (New page: ==Trial Runs== Below are images for the several different trial runs that we performed on three different Cyclone III FPGAs. Each of these three chips had a pocket milled out on the top of...)

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Trial Runs

Below are images for the several different trial runs that we performed on three different Cyclone III FPGAs. Each of these three chips had a pocket milled out on the top of varying depth. More information can be found in the Acid Etching Documentation.

Trial 1

  • Trial 1 was performed on the test chip with a 3/10mm pocket milled out in a 10x10 square on the top of the chip. This trial shows what happens when the RFNA (Red Fuming Nitric Acid) is left on the chip for far too long.

Figure0.jpg Figure1.jpg Figure2.jpgFigure3.jpg Figure4.jpg Figure5.jpg

Trial 2

  • Trial 2 was performed on the test chip with a 1/4mm pocket milled out in a 10x10 square on the top of the chip. This trial had significantly better results than Trial 1. The entire die can be seen (ie. not eaten away by RFNA), and there looks to be a minimal amount of damage to both the bond wires and the die itself. There was a residual amount of packaging left on the die.

After 1 Minute of Die Exposed to RFNA

Trial2 1min .78x 1.jpg Trial2 1min 2.5x 1.jpg Trial2 1min 2.5x 2.jpg

After 2 Minutes of Die Exposed to RFNA

Trial2 2min .78x 1.jpg Trial2 2min 1.25x 1.jpg Trial2 2min 16x 1.jpg Trial2 2min 16x 2.jpg

After 3 Minutes of Die Exposed to RFNA

Trial2 3min .78x 1.jpg Trial2 3min 2.5x 1.jpg Trial2 3min 2.5x 2.jpg Trial2 3min 2.5x 3.jpg Trial2 3min 2.5x 4.jpg Trial2 3min 2.5x 5.jpg Trial2 3min 4x 1.jpg Trial2 3min 10x 1.jpg Trial2 3min 10x 2.jpg